作者: Kenichiro Murata , Osamu Kawauchi , Kenji Sakurai
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摘要: The invention provides a method of sealing piezoelectric devices with covers capable rapidly and securely plurality packages or many covers. A device includes package in which vibrating reed is partially supported fixed, cover fixed to the packages. In covers, are arranged bottoms facing halogen lamps, so that irradiated light beams from lamps thermally melt brazing material disposed between