On the kinetic behavior and driving force of diffusion induced grain boundary migration

作者: C.Y. Ma , E. Rabkin , W. Gust , S.E. Hsu

DOI: 10.1016/0956-7151(95)00011-J

关键词:

摘要: … , the coherency strain driving force for GB … driving force should be involved. The nucleation and initial stages of the DIGM process can be explained by a model based on the diffusion …

参考文章(25)
Molly Gleiser, Kenneth K Kelley, Pramod D Desai, Donald T Hawkins, Ralph Hultgren, Selected values of the thermodynamic properties of binary alloys University Microfilms International. ,(1973)
Z.M. Guan, G.X. Liu, D.B. Williams, M.R. Notis, Diffusion-induced grain boundary migration and associated concentration profiles in a CuZn alloy Acta Metallurgica. ,vol. 37, pp. 519- 527 ,(1989) , 10.1016/0001-6160(89)90235-6
Mats Hillert, On the driving force for diffusion induced grain boundary migration Scripta Metallurgica. ,vol. 17, pp. 237- 240 ,(1983) , 10.1016/0036-9748(83)90105-9
J.D Pan, R.W Balluffi, Diffusion induced grain boundary migration in AuCu and AuAg thin films Acta Metallurgica. ,vol. 30, pp. 861- 870 ,(1982) , 10.1016/0001-6160(82)90084-0
E.I. Rabkin, Diffusion from the vapour phase into a geometrically fixed sample: Application to DIGM Scripta Metallurgica Et Materialia. ,vol. 30, pp. 1043- 1048 ,(1994) , 10.1016/0956-716X(94)90552-5
E. Rabkin, Gradient and coherency strain energies as driving forces for DIGM Scripta Metallurgica et Materialia. ,vol. 30, pp. 1443- 1448 ,(1994) , 10.1016/0956-716X(94)90243-7
F.J.A. den Broeder, S. Nakahara, Diffusion induced grain boundary migration and recrystallization in the CuNi system Scripta Metallurgica. ,vol. 17, pp. 399- 404 ,(1983) , 10.1016/0036-9748(83)90181-3
E.I. Rabkin, L.S. Shvindlerman, W. Gust, Theory of grain boundary motion during high-temperature DIGM Interface Science. ,vol. 1, pp. 133- 137 ,(1993) , 10.1007/BF00203602
D. Liu, W.A. Miller, K.T. Aust, Diffusion induced grain boundary migration in Ni-Cu Diffusion couples Acta Metallurgica. ,vol. 37, pp. 3367- 3378 ,(1989) , 10.1016/0001-6160(89)90209-5
M. Kuo, R.A. Fournelle, Diffusion induced grain boundary migration (DIGM) and liquid film migration (LFM) in an Al-2.07 wt% Cu alloy Acta Metallurgica Et Materialia. ,vol. 39, pp. 2835- 2845 ,(1991) , 10.1016/0956-7151(91)90101-6