作者: U. Sener , B. Parekh , A. Entenberg , T. Debies , G. A. Takacs
DOI: 10.1163/156856106776381776
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摘要: Poly(biphenyl dianhydride-para-phenylene diamine) (BPDA-PDA, Upilex-S) polyimide (PI), was exposed to 185 and 254 nm UV radiation in the presence of oxygen at atmospheric pressure. SEM micrographs revealed only a small change surface morphology following treatment. XPS showed an approximate doubling O/C ratio on modified surfaces which appeared mostly as carbonyl moiety. photo-oxidation degraded Upilex-S produce locus failure below interface (cohesive failure). TOF-SIMS results indicated that thickness remaining sputtered Cu after tape test Cu-modified < 10 nm. Cohesive occurred shorter treatment times when sputter coated BPDA-PDA than poly(pyromellitic dianhydide-oxydianiline) (PMDA-ODA) PI.