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作者: Jiang Zhou , Linsen Zhu , Xuejun Fan
DOI: 10.3970/CMC.2014.039.113
关键词:
摘要:
international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems,2015, 引用: 3
Engineering,2015, 引用: 4
Journal of Polymer Science Part B,2015, 引用: 10
Microelectronics Reliability,2017, 引用: 6
Applied Mechanics Reviews,2018, 引用: 9
electronic components and technology conference,2019, 引用: 2