High-temperature deformation behavior of Cu–6.0Ni–1.0Si–0.5Al–0.15 Mg–0.1Cr alloy

摘要: The hot compression deformation behavior of Cu–6.0Ni–1.0Si–0.5Al–0.15 Mg–0.1Cr alloy with high strength, stress relaxation resistance and good electrical conductivity was investigated using a Gleeble1500 thermal–mechanical simulator at temperatures ranging from 700 to 900 °C strain rates 0.001 1 s−1. Working hardening, dynamic recovery recrystallization play important roles affect the plastic alloy. According stress–strain data, constitutive equation has been carried out activation energy is 854.73 kJ/mol. Hot processing map established on basis material model theories, Prasad instability criterion indicates that appropriate temperature range rate for were 850~875 0.001~0.01 s−1, which agreed well rolling experimentation results.