Prediction of hot deformation behavior of Al–5.9%Cu–0.5%Mg alloys with trace additions of Sn

作者: Sanjib Banerjee , PS Robi , A Srinivasan , None

DOI: 10.1007/S10853-011-5873-1

关键词:

摘要: High temperature deformation behavior of Al–5.9wt%Cu–0.5wt%Mg alloys containing trace amounts (from 0 to 0.1 wt%) Sn was studied by hot compression tests conducted at various temperatures and strain rates. The peak flow stress the increased with increase in rate decrease temperature. could be correlated a suitable hyperbolic-sine constitutive equation. activation energy for alloy without content observed 183.4 kJ mol−1 which 225.5 due 0.08 wt% addition. Zener-Hollomon parameter (Z) determined deforming conditions. tendency dynamic recrystallization low Z values, corresponding high stresses processing conditions have been predicted modeling experimental results fairly good accuracy. It possible predict 80, 75, 100, 90, 85% values within an error less than ±13%, investigated alloys. With addition >0.04 wt%, significantly all combinations. Scanning electron microscope revealed two types second phases grain boundary undeformed matrix, one being Al–Cu–Si–Fe–Mn phase while other identified as CuAl2. strength value 0.06 content, may attributed variation amount, composition, morphology phase, well lower precipitation reaction, from differential scanning calorimetric studies.

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