作者: Kenji Sudou
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摘要: An evaporating apparatus includes: a plurality of vapor deposition sources for respectively vaporizing different film forming materials accommodated therein; blowing devices off vaporized from the through openings; and one or more partition walls separating adjacent devices. The are installed such that relationships gap G between each wall substrate, height T opening to top surface wall, thickness D distance E center position source satisfy an inequality E<(G+T)×D/2G. Further, internal pressure processing chamber is controlled be about 0.01 Pa less.