Adsorption behavior of As(III) onto a copper ferrite generated from printed circuit board industry
作者： Yao-Jen Tu , Chen-Feng You , Chien-Kuei Chang , Shan-Li Wang , Ting-Shan Chan
DOI: 10.1016/J.CEJ.2013.03.120
关键词:
摘要: Abstract A copper ferrite generated from the sludge of printed circuit board (PCB) industry was investigated for its As(III) adsorption behavior. The by this exhibited a L-shaped nonlinear isotherm and fitted well Langmuir isotherm, implying limited binding sites monolayer sorption occurred on surface. K-edge X-ray Absorption Near-Edge Structure (XANES) showed that adsorbed could be oxidized to less toxic As(V) ferrite. maximum As capacity 41.2 mg g −1 at pH 4.2 decreased dramatically higher (pH > 9.2) due enhanced electrostatic repulsion between adsorbent Desorption using four different acid solutions demonstrated desorption rate in order H 3 PO 4 > H 2 SO > HCl > HNO . These results demonstrate synthesized is an effective removing aqueous solution. new data obtained reveals informative knowledge designing arsenic removal technology treating contaminated groundwater.
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