A sensitive bending beam apparatus for measuring the stress in evaporated thin films
作者： J.D. Wilcock , D.S. Campbell
DOI: 10.1016/0040-6090(69)90107-2
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摘要: A bakeable capacity method apparatus for measuring the stress in evaporated films is described. It comparable sensitivity to surface probe (inductive) method. successful technique measurement of substrate Young's Modulus using same also given.
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