Preparation of direct plated copper ceramic spreader using electroless copper as seed layer
作者： Ziliang Hao , Xuebin Zhang , Chen Chen , Mingxiang Chen
DOI: 10.1109/ICEPT.2014.6922657
关键词:
摘要: Electroless copper plating has attracted more and interests as an effective process for metalizing ceramic surface. Direct plated (DPC) spreader been widely used high-power LED packing. Usually, preparation of DPC sputtering Ti/Cu seed layer following by thick plating. In this work, fabrication was optimized applying the electroless layer. The orthogonal experiment, single-factor analysis other methods were to optimize process, coating properties evaluated tensile test, scanning electron microscope (SEM) energy dispersive spectrometer (EDS).
sci-hub.se 参考文章(9)
Hui Wang, Jianfeng Jia, Hongzhang Song, Xing Hu, Hongwei Sun, Delin Yang, The preparation of Cu-coated Al2O3 composite powders by electroless plating Ceramics International. ,vol. 37, pp. 2181- 2184 ,(2011) , 10.1016/J.CERAMINT.2011.03.013
Li-Mei Huang, Lai-Ma Luo, Xiao-Yu Ding, Guang-Nan Luo, Xiang Zan, Ji-Gui Cheng, Yu-Cheng Wu, Effects of simplified pretreatment process on the morphology of W–Cu composite powder prepared by electroless plating and its sintering characterization Powder Technology. ,vol. 258, pp. 216- 221 ,(2014) , 10.1016/J.POWTEC.2014.03.027
K. G. Wang, W. C., Vora, R. H., Kang, E. T., & Neoh, Electroless plating of copper on fluorinated polyimide films modified by surface graft copolymerization with 1‐vinylimidazole and 4‐vinylpyridine Polymer Engineering and Science. ,vol. 44, pp. 362- 375 ,(2004) , 10.1002/PEN.20033
Nathan Warner, Michael L. Free, The electrochemical recovery of metallic palladium from spent electroless plating solution JOM. ,vol. 61, pp. 27- 30 ,(2009) , 10.1007/S11837-009-0148-X
Chen-Yu Kao, Kan-Sen Chou, Electroless Copper Plating onto Printed Lines of Nanosized Silver Seeds Electrochemical and Solid State Letters. ,vol. 10, ,(2007) , 10.1149/1.2431241
Teija Laine‐Ma, Pekka Ruuskanen, Satu Kortet, Mikko Karttunen, Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards Circuit World. ,vol. 35, pp. 22- 30 ,(2009) , 10.1108/03056120911002389
Chunju Xu, Guilin Liu, Huiyu Chen, Ruihua Zhou, Yaqing Liu, Fabrication of conductive copper-coated glass fibers through electroless plating process Journal of Materials Science: Materials in Electronics. ,vol. 25, pp. 2611- 2617 ,(2014) , 10.1007/S10854-014-1919-X
Andrew J. Cobley, Veronica Saez, The use of ultrasound to enable low temperature electroless plating Circuit World. ,vol. 38, pp. 12- 15 ,(2012) , 10.1108/03056121211195003
Shou-Yi Chang, Jiunn-Horng Lin, Su-Jien Lin, Theo Z. Kattamis, Processing copper and silver matrix composites by electroless plating and hot pressing Metallurgical and Materials Transactions A. ,vol. 30, pp. 1119- 1136 ,(1999) , 10.1007/S11661-999-0164-Z