作者: Hui Wang , Jianfeng Jia , Hongzhang Song , Xing Hu , Hongwei Sun
DOI: 10.1016/J.CERAMINT.2011.03.013
关键词: Coating 、 Electroless plating 、 Formaldehyde 、 Copper plating 、 Layer (electronics) 、 Chemical engineering 、 Metallurgy 、 Plating 、 Composite number 、 Copper 、 Materials science
摘要: … The content of copper in the composite powders could be effectively controlled by adjusting the content of copper sulfate and formaldehyde in the plating solution. Furthermore, the …