The preparation of Cu-coated Al2O3 composite powders by electroless plating

作者: Hui Wang , Jianfeng Jia , Hongzhang Song , Xing Hu , Hongwei Sun

DOI: 10.1016/J.CERAMINT.2011.03.013

关键词: CoatingElectroless platingFormaldehydeCopper platingLayer (electronics)Chemical engineeringMetallurgyPlatingComposite numberCopperMaterials science

摘要: … The content of copper in the composite powders could be effectively controlled by adjusting the content of copper sulfate and formaldehyde in the plating solution. Furthermore, the …

参考文章(16)
Hae Jin Hwang, Motohiro Toriyama, Tohru Sekino, Koichi Niihara, In-situ fabrication of ceramic/Metal nanocomposites by reduction reaction in barium titanate–Metal oxide systems Journal of the European Ceramic Society. ,vol. 18, pp. 2193- 2199 ,(1998) , 10.1016/S0955-2219(98)00154-X
D-Y Wang, C-L Chang, K-W Wong, Y-W Li, W-Y Ho, None, Improvement of the interfacial integrity of (Ti,Al)N hard coatings deposited on high speed steel cutting tools Surface and Coatings Technology. ,vol. 120-121, pp. 388- 394 ,(1999) , 10.1016/S0257-8972(99)00452-1
Jinhui Dai, Xizhong Liu, Huazhang Zhai, Zhongfang Liu, Jintao Tian, Preparation of Ni-coated Si3N4 powders via electroless plating method Ceramics International. ,vol. 35, pp. 3407- 3410 ,(2009) , 10.1016/J.CERAMINT.2009.06.007
W.H. Lin, H.F. Chang, Effect of chelating agents on the structure of electroless copper coating on alumina powder Surface & Coatings Technology. ,vol. 107, pp. 48- 54 ,(1998) , 10.1016/S0257-8972(98)00553-2
O.A. Harizanov, P.L. Stefchev, A. Iossifova, Metal coated alumina powder for metalloceramics Materials Letters. ,vol. 33, pp. 297- 299 ,(1998) , 10.1016/S0167-577X(97)00112-2
C. Zhang, G.P. Ling, J.H. He, Co–Al2O3 nanocomposites powder prepared by electroless plating Materials Letters. ,vol. 58, pp. 200- 204 ,(2004) , 10.1016/S0167-577X(03)00445-2
Kuen-Ming Shu, G.C Tu, The microstructure and the thermal expansion characteristics of Cu/SiCp composites Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 349, pp. 236- 247 ,(2003) , 10.1016/S0921-5093(02)00788-8