Wiring substrate and method of manufacturing the same, and semiconductor device and method of manufacturing the same
作者： Hiroshi Kikuchi , Yoshiaki Takemoto , Chihiro Migita , Yoshitaka Tadaki
DOI:
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摘要: A wiring substrate may include: a base having predetermined thickness; plurality of electrode portions formed to protrude on one surface in thickness direction the base; provided and electrically connected portions; resin layer fill between portions. An upper be concave shape lower than maximum height portion, an portion form continuous curved surface.
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