作者: Isao Isshiki , Shigeki Yamane , Takahiro Onizuka
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摘要: In the power distributor using a semiconductor switching element, input terminals 10I and 10L, output 12A-12J, connected to more preferably, board 30 32, are structured by metallic plate, arranged on same plane perpendicular plate thickness. The can be integrated resin mold, thereby structure greatly simplified. produced simple method which, after punching out of molding predetermined portion is cut element mounted, it contribute also reduction cost.