作者: Fekadu Gochole Aga , Jiyong Woo , Sangheon Lee , Jeonghwan Song , Jaesung Park
DOI: 10.1063/1.4941752
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摘要: We investigate the effect of Cu concentration On-state resistance retention characteristics W/Cu/Ti/HfO2/Pt memory cell. The development RRAM device for application depends on understanding failure mechanism and key parameters optimization. In this study, we develop analytical expression cations (Cu+) diffusion model using Gaussian distribution detailed analysis data time at high temperature. It is found that improvement not only conductive filament (CF) size but also atoms density in CF. Based simulation result, better observed electron wave function associated with Cu+ overlap an extended state formation. This can be verified by calculation atom defects inside filament, based model. importance reliability corresponding local temperature were analyzed ...