作者: Darı́o L. Goldfarb , Juan J. de Pablo , Paul F. Nealey , John P. Simons , Wayne M. Moreau
DOI: 10.1116/1.1313582
关键词:
摘要: … drying process was developed to eliminate the capillary forces naturally present during normal drying of … volume of the chamber (30 cm3) allowed 62.5 cm pieces of wafers to be dried. …