作者: Mark D. Vaudin , Yvonne B. Gerbig , Stephan J. Stranick , Robert F. Cook
DOI: 10.1063/1.3026542
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摘要: Stresses in Si as small 10 MPa have been measured using electron backscattered diffraction (EBSD) and confocal Raman microscopy (CRM) with spatial resolutions of nm 100 nm, respectively. In both techniques, data were collected across wedge indentations (001) Si. EBSD the stress strain tensors CRM uniaxial stress. The results agreed very well except close to indentation, where surface-sensitive indicated larger stresses. Results converged when laser excitation wavelength was reduced, probing smaller depths. profiles are consistent inverse-square power law predicted by Eshelby analysis.