MANUFACTURE OF CHIP CAPACITOR

摘要: PURPOSE:To prevent the electrical connection of a ground electrode and top face by forming first trench, which does not reach up to surface from rear substrate, shaping metallic layer onto whole including trench second reaching substrate narrower in width than that trench. CONSTITUTION:The side high dielectric-constant 101 is bonded with support board 104 such as an silicon wax 105, 11, shaped blade dicing saw, etc., 80mum depth 100mum width. For form for grounding underside, nichrome 1000Angstrom gold 10000Angstrom are evaporated through planetarium system, 12 underside. A 21 formed into on underside shaped, 120mum 70mum Wax 105 melted removed, separated 104, thus acquiring each chip capacitor.