Effect of solution temperature on aging behavior and properties of SiCp/Al–Cu–Mg composites
作者： P. Jin , B.L. Xiao , Q.Z. Wang , Z.Y. Ma , Y. Liu
DOI: 10.1016/J.MSEA.2010.10.075
关键词:
摘要: Abstract In this study, the effect of solution temperature on artificial aging kinetics 15 vol.% SiC particles reinforced 2009Al (SiCp/2009Al) composite prepared using a powder metallurgy method was investigated by means microstructural examinations, hardness measurement and DSC analyses. The study indicated that, with increasing from 495 to 560 °C, while GP zone formation dissolution were retarded due decreased quenched-in vacancy concentration, S′ precipitation promoted increased dislocation density. This accelerated 560 °C. Furthermore, which solutionized at 530 °C exhibited highest peak tensile strength. behavior properties explained in terms variation microstructual mechanisms.
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