Integration of robust fluidic interconnects using metal to glass anodic bonding

摘要: This paper reports on the encapsulation of a piezoresistive silicon/Pyrex liquid flow sensor using metal to glass anodic bonding. The bonding technique allowed integrating robust metallic microfluidic interconnects and eliminating use glue O-rings. parameters silicon/Pyrex/metal triple stack were chosen minimize residual stress obtain strong tight interface. was successfully bonded plates Kovar Alloy 42, which tubes fixed printed circuit board (PCB) integrated. A post-bonding annealing procedure developed reduce stress. characteristics encapsulated sensor, such as temperature coefficient sensitivity, fulfilled specifications. Wafer level packaging considered size cost.