Design for hot-carrier reliability of HV UMOS

作者: Chirag Aryadeep , Gene Sheu , Sivaji Selvendran , Suman Jaiswal , S. Krishna Sai

DOI: 10.1109/ISNE.2017.7968721

关键词:

摘要: An innovative and improved UMOS device structure, with gate oxide 900 to 1500A, breakdown voltage 40 100V, robust hot carrier injection (HCI) stress is proposed. We demonstrate report the effect of p-type n-type doping in poly-gate region can improve HCI performance significantly. The UMOSFETs HCI, response been studied.

参考文章(3)
S.A. Suliman, O.O. Awadelkarim, S.J. Fonash, G.M. Dolny, J. Hao, R.S. Ridley, C.M. Knoedler, The effects of channel boron-doping on the performance and hot electron reliability of N-channel trench UMOSFETs Solid-state Electronics. ,vol. 45, pp. 655- 661 ,(2001) , 10.1016/S0038-1101(01)00124-1
Wang Ying, Hu Haifan, Wang Liguo, Yu Chenghao, Split gate resurf stepped oxide UMOSFET with P-pillar for improved performance Iet Power Electronics. ,vol. 7, pp. 965- 972 ,(2014) , 10.1049/IET-PEL.2013.0363