作者: Gaurav Saxena , Roy Paily
DOI: 10.1007/S00542-014-2337-Y
关键词:
摘要: In this paper, we investigate four different heater geometries viz. Meander, S-shape, Double-Meander and Double-Spiral for their inherent thermal uniformity. Microheater with optimum dimensions of insulation layer is employed to decrease the deposition time improve Simulation studies are carried out find dimension layer, required a targeted uniformity 0.22 K/$$\upmu \mathrm{{m}}$$μm, value comparable reported literature. Meander $$8\,\upmu \mathrm{m}$$8μm nitride has resulted in an 0.174 whereas, S-shape $$4\,\upmu \mathrm{m}$$4μm 0.161 \mathrm{{m}}$$μm. With silicon carbide (SiC) only $$0.8\,\upmu \mathrm{m}$$0.8μm thick obtain 0.166 The combination two methods i.e, choice suitable geometry plus optimization dimensions, served purpose electrical while improving reducing thickness, all at nominal increment ($$7.1\,\%$$7.1%) power consumption.