Method and system for drawing wafer copper film thickness view
作者： Zhao Qian , Yu Qiang , Li Hongkai , Lu Xinchun , He Yongyong
DOI:
关键词:
摘要: The invention provides a method and system for drawing wafer copper film thickness view. comprises the following steps that measurement data of are obtained; coordinate distribution points is determined according to pattern data, made correspond all point coordinates in one-to-one mode; view drawn data. Based on view, multiple pattern, each point; need user function met, development difficulty level lowered, use convenient flexible.
lens.org 参考文章(5)
Linwei Ren, Wafer and method for manufacturing locating marker thereon ,(2011)
Meng Yonggang, Zhao Dewen, Tian Fangxin, Zhao Qian, Yu Qiang, Li Hongkai, Lu Xinchun, Wafer copper film thickness off-line measuring module control system ,(2013)
Siming Jiang, Fuhong Li, Yu Yao, Feiyao Zhang, Method for distributing wafer plainness measuring point ,(2008)
Binglong Wang, Xincheng Chen, Minghao Zhou, Wafer detection system ,(2009)