Offline processing method for metal film thickness data in whole CMP (Chemical Mechanical Planarization) process

摘要: The invention provides an offline processing method for metal film thickness data in a whole CMP (Chemical Mechanical Planarization) process. comprises the following steps: reading output signal of electric eddy sensor, and calculating sampling according to signal; setting amplitude threshold value traversing all signals obtain non-zero point sections value; width each section, determining width; measurement process again value, extracting effective average points central interval section; acquiring change information value. According method, influence interference part abnormal can be effectively eliminated; real copper layer calculated concisely effectively; moreover, calculation result accuracy is high.