Assembly of mechanically compliant interfaces between optical fibers and nanophotonic chips

摘要: Silicon nanophotonics may bring disruptive advances to datacom, telecom, and high performance computing. However, the deployment of this technology is hampered by difficulty cost efficient optical inputs outputs. To address challenge, we have recently proposed a low-cost, mechanically compliant polymer interface between standard single mode fibers nanophotonic waveguides. Our concept promises better mechanical reliability than existing technology. manage assembly, show here that self-alignment features can be effectively used bridge gap accuracy required single-mode optics (1-2 um) capability high-throughput microelectronic assembly equipment (~10 um). We describe complaint interface, strategy, design our re-alignment features. demonstrate experimentally misalignments at as large +/-10 um are re-aligned structures +/-1 2 um. approach enables microelectronics for singlemode assembly.