Improved connectorization of compliant polymer waveguide ribbon for silicon nanophotonics chip interfacing to optical fibers

摘要: Optical packaging is one of the key challenges silicon nanophotonics. Most existing optical techniques, however, have scalability limitations in chip size, channel count manufacturing cost. As solution, we demonstrated a new method low-cost, mechanically compliant polymer interface between standard single mode fibers and nanophotonic waveguides. This gives better mechanical reliability performance than methods. To achieve high precision assembly to meet with optics alignment accuracy, used self-alignment features bridge gap accuracy required by single-mode (1–2 um) capability high-throughput microelectronic equipment (∼10 um). Although was effective for lateral positioning, precise thickness control layer necessary positioning height direction. Since tight waveguide sometimes difficult realize, improved without requiring film. The has been confirmed passive ribbon connector ferrule designed this method.