作者: J. Kister , R.L. Franch
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摘要: Membrane probe technology represents a significant advance in wafer probing over conventional needletype cards. We describe several improvements to membrane probes that have been made since their introduction. These include the use of 2-sided metal patterning on membrane, introduction vias thut can be placed anywhere an improved lower inductance power distribution geometry, process attach decoupling component!; directly within millimeters chip pads, force-delivery mechanism and membrane-to-PC board microstrip transition. Measured test results 512Kb SRAM operating at 200 MHz arc? presented compared needle results.