Method and device for interconnecting integrated circuits in three dimensions
作者： Michel Leroy , Christian Val
DOI:
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摘要: A method and device for interconnecting stacked semiconducting plates, in which each of the plates has an integrated circuit. The (P) are made solid with other. In one embodiment, their connecting contacts connected by a wire (F) to any faces stack except (B), is be contact printed Connections together circuit on (F V , F S L ) stack.
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