作者: Khaled Sadek , Walied Moussa
DOI: 10.3390/S7030319
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摘要: In this paper, the reliability of a micro-electro-mechanical system (MEMS)-based gas sensor has been investigated using Three Dimensional (3D) coupled multiphysics Finite Element (FE) analysis. The field analysis involved two-way sequential electro- thermal fields coupling and one-way thermal-structural coupling. An automated substructuring code was developed to reduce computational cost in simulating complicated FE by up 76 percent. substructured model then used conduct parametric study MEMS-based performance response variations expected mechanical characteristics thin films layers composing sensing MEMS device generated at various stages microfabrication process. Whenever possible, appropriate deposition variables were correlated current work design parameters, with good accuracy, for optimum operation conditions sensor. This is establish set rules, linear nonlinear empirical relations, which can be utilized real-time development decision-making similar sensors enable these reliable operation.