Hermetically sealed metal package
作者： Sheldon H. Butt
DOI:
关键词:
摘要: The present invention is directed to a hermetically sealed package adapted form an enclosure for semiconductor device. comprises substrate with refractory oxide layer on one surface and metallized band the layer. A metal cover disposed band. lead frame between plurality of elements which extend into be electrically connected has its insulate from both cover. also solder component bonds onto extending therebetween so that electronic device within closure.
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