Solder plating process
作者： Paul A. Kohl
DOI:
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摘要: A process for electroplating tin, lead or alloys of tin and from aqueous acidic baths. The baths comprise lactones, lactams, cyclic sulfate esters, imides oxazolinones. additives assist in providing a which permits high speed plating with excellent layer properties such as smooth platings free dendritic growth having constant thickness over wide areas.
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