Tin whisker-free printed circuit board
作者： John R. Kochilla , George S. Bokisa , Craig V. Bishop
DOI:
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摘要: A printed circuit board including electrical circuitry formed on an outer surface of the board, comprising copper or a alloy; final finish circuitry, coating tin alloy circuitry; and cap layer coating, at least two immersion-platable metals. The immersion platable metals in may be selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium cobalt. remains whisker free solderable.
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