Optoelectronic semiconductor chip and method for fabricating an optoelectronic semiconductor chip
作者： Wolfgang Schmid , Franz Eberhard
DOI:
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摘要: Various embodiments of the optoelectronic semiconductor chip have a radiation out-coupling side (102) and contact connection. The has had metal material (210) applied to it. conductive connection (106) which been is connected A method for fabricating an specified.
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