Cooper-plating solution, plating method and plating apparatus

摘要: There is provided a copper-plating solution which, when used in plating of substrate having an seed layer and fine recesses high aspect ratio, can reinforce the thin portion ensures complete filling with copper recesses, which so stable that its performance not lowered after long-term continuous use thereof. The contains monovalent or divalent ions, complexing agent, organic sulfur compound as additive, optionally surfactant.