Method for laser singulation of chip scale packages on glass substrates
作者： Yasu Osako , James O'Brien , Peter Pirogovsky , Jeffery A. Albelo
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摘要: An improved method for singulation of compound electronic devices is presented. Compound are manufactured by combining two or more substrates into an assembly containing multiple devices. Presented methods using laser processing. The presented provide fewer defects such as cracking chipping the while minimizing width kerf and maintaining system throughput.
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