Insulation enhancement with heat-shrinkable components

作者: J.W. Hoffman

DOI: 10.1109/57.75767

关键词:

摘要: The basic performance requirements for heat-shrinkable components and the compounding processing techniques that are used to meet these covered. emphasis is on electrical, mechanical, environmental protection features of low-voltage (up 1 kV) applications. aim provide a fundamental understanding capabilities applications insulation enhancement electrical systems. Cross-linking, polymer selection, compounding, manufacturing, sealants, installation, product configurations discussed. >

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