Bottom-Up Fill of Copper in Deep Submicrometer Holes by Electroless Plating
作者： Shoso Shingubara , Zengling Wang , Osamu Yaegashi , Ryo Obata , Hiroyuki Sakaue
DOI: 10.1149/1.1707029
关键词:
摘要: … nm may be deposited by electroless plating over a 1 nm thick … the additives in the electroless plating solution. While bottom-… bottom-up deposition by electroless plating. Lopatin and co-…
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researchgate.net 参考文章(24)
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