Surface treatment method of chip, bonding method, and surface treatment device

摘要: PROBLEM TO BE SOLVED: To provide a technique for bonding plurality of chips to substrate, such as wafer, efficiently and stably by leaving no undesirable residue, an oxide, on junction interface, thereby processing the in oxidative atmosphere, before after surface treatment.SOLUTION: The treatment method metal region chip having side interface one or regions substrate includes step S1 preparing where is coated with volatile material, S2 evaporating material exposing region, S3 performing activation colliding particles predetermined kinetic energy against non-oxidative following further hydrophilic depositing water.