METHODS OF BONDING OF SEMICONDUCTOR ELEMENTS TO SUBSTRATES, AND RELATED BONDING SYSTEMS
作者： Bajwa Adeel Ahmad , Colosimo Thomas J
DOI:
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摘要: A bonding system for a semiconductor element to substrate is provided. The includes oxide reduction chamber configured receive substrate. plurality of first electrically conductive structures. reducing gas contact each the also prevention receiving after contacts has an inert environment when delivery providing during
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