Multiple-Layer Multiple-Patterning Aware Placement Refinement for Mixed-Cell-Height Designs

作者: Wai-Kei Mak , Ting-Chi Wang , Bo-Yang Chen , Chi-Chun Fang

DOI: 10.1145/3439706.3447048

关键词:

摘要: Conventional lithography techniques are unable to achieve the resolution required by advance technology nodes. Multiple patterning (MPL) has been introduced as a viable solution. Besides, new standard cell structure with multiple middle-of-line (MOL) layers is adopted improve intra-cell routability. A mixed-cell-height library, consisting of cells single-row and multiple-row heights, also used in designs for power, performance area concerns. As result, it becomes increasingly difficult get feasible placement design where require MPL. In this paper, we present methodology refine given satisfying MPL requirements on much possible, while minimizing total displacement. We introduce concept uncolored group (UCG) facilitate effective removal coloring conflicts. By eliminating UCGs without generating any conflict around them, number effectively reduced local global refinement stages our methodology. report promising experimental results demonstrate efficacy

参考文章(14)
Hsi-An Chien, Szu-Yuan Han, Ye-Hong Chen, Ting-Chi Wang, A Cell-Based Row-Structure Layout Decomposer for Triple Patterning Lithography international symposium on physical design. pp. 67- 74 ,(2015) , 10.1145/2717764.2717768
Bei Yu, Xiaoqing Xu, Jhih-Rong Gao, Yibo Lin, Zhuo Li, Charles J Alpert, David Z Pan, None, Methodology for Standard Cell Compliance and Detailed Placement for Triple Patterning Lithography IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. ,vol. 34, pp. 726- 739 ,(2015) , 10.1109/TCAD.2015.2401571
Hsi-An Chien, Ye-Hong Chen, Szu-Yuan Han, Hsiu-Yu Lai, Ting-Chi Wang, On Refining Row-Based Detailed Placement for Triple Patterning Lithography IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. ,vol. 34, pp. 778- 793 ,(2015) , 10.1109/TCAD.2015.2408253
Shao-Yun Fang, Yao-Wen Chang, Wei-Yu Chen, A Novel Layout Decomposition Algorithm for Triple Patterning Lithography IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. ,vol. 33, pp. 397- 408 ,(2014) , 10.1109/TCAD.2013.2288678
Bei Yu, Kun Yuan, Duo Ding, David Z. Pan, Layout Decomposition for Triple Patterning Lithography IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. ,vol. 34, pp. 433- 446 ,(2015) , 10.1109/TCAD.2014.2387840
Kun Yuan, Jae-Seok Yang, David Z. Pan, Double Patterning Layout Decomposition for Simultaneous Conflict and Stitch Minimization IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. ,vol. 29, pp. 185- 196 ,(2010) , 10.1109/TCAD.2009.2035577
Yue Xu, Chris Chu, A matching based decomposer for double patterning lithography international symposium on physical design. pp. 121- 126 ,(2010) , 10.1145/1735023.1735054
Gang Wu, Chris Chu, Detailed Placement Algorithm for VLSI Design With Double-Row Height Standard Cells IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. ,vol. 35, pp. 1569- 1573 ,(2016) , 10.1109/TCAD.2015.2511141
Hua-Yu Chang, Iris Hui-Ru Jiang, Multiple patterning layout decomposition considering complex coloring rules design automation conference. pp. 40- ,(2016) , 10.1145/2897937.2898048
Yibo Lin, Bei Yu, Biying Xu, David Z. Pan, Triple Patterning Aware Detailed Placement Toward Zero Cross-Row Middle-of-Line Conflict IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. ,vol. 36, pp. 1140- 1152 ,(2017) , 10.1109/TCAD.2017.2648843