A Low-Loss Substrate-Independent Approach for 60-GHz Transceiver Front-End Integration Using Micromachining Technologies
作者： Bo Pan , Yuan Li , G.E. Ponchak , M.M. Tentzeris , J. Papapolymerou
DOI: 10.1109/TMTT.2008.2007358
关键词:
摘要: This paper presents a low-loss, substrate-independent approach to integrate transceiver front-ends for 60-GHz wireless applications. Dielectric loss is eliminated by using polymer and bulk silicon micromachining technologies create cavity-based duplexer horn antenna in the air, above substrate. A coplanar waveguide input used easy integration of low-noise amplifier power receiver transmitter, respectively, with micromachined passive module. prototype designed, fabricated, characterized, transmit band (TX) set between 58.7-59.5 GHz receive (RX) as 60.6-61.4 GHz. The proposed method offers an both planar components 3-D integrated modules on top
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