Ultrasonic thickness measurement method

摘要: The invention relates to the technical field of modern technology special equipment, and specifically an ultrasonic thickness measurement method. method comprises following steps: step 1, measuring a position data layer, 2, layer. On condition that tested device is not damaged, or material layer in can be accurately detected, internal defect equipment also found at same time, very important role played product quality control other aspects. has great prospect direction, plays semiconductor packaging industry.