Design and characterization of thin film microcoolers
作者： Chris LaBounty , Ali Shakouri , John E. Bowers
DOI: 10.1063/1.1353810
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摘要: Thin film coolers can provide large cooling power densities compared to bulk thermoelectrics due the close spacing of hot and cold junctions. Important parameters in design such are investigated theoretically experimentally. A three-dimensional (3D) finite element simulator (ANSYS) is used model self-consistently thermal electrical properties a complete device structure. The dominant spreading resistances acquired from 3D simulation also one-dimensional (MATLAB) obtain faster, less rigorous results. Heat conduction, Joule heating, thermoelectric thermionic included these models as well nonideal effects contact resistance, resistance substrate heat sink, generation wire bonds. Simulations exhibit good agreement with experimental results InGaAsP-based thin emission which have demonstrated maximum 1.15 °C at room temperature. With minimized, simulations predict that single stage up 20–30 °C degrees centigrade several 1000 W/cm2.Thin o...
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