Thermally enhanced semiconductor package with EMI shielding
作者： Ying-Ren Lin , Ho-Yi Tsai
DOI:
关键词:
摘要: A thermally enhanced semiconductor package with EMI (electric and magnetic interference) shielding is provided in which a chip mounted on electrically connected to surface of substrate, conductive member stacked the coupled substrate by bonding wires. An encapsulant formed encapsulates chip, member, plurality solder balls are implanted an opposite substrate. The grounded via wires, balls, provides effect for protect against external electric interference. has coefficient thermal expansion similar that reduces stress exerted enhances mechanical strength thereby prevent cracks.
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