Single lead automatic clamping and bonding system
作者： Douglas W. Phelps , Robert J. Redmond , Stephen G. Starr , Judith A. Chase
DOI:
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摘要: A system of single lead clamping and bonding in the assembly integrated circuit devices. capillary bonder has a clamp member (28) rotatably mounted around (26) for movement with bond head. The is moveable vertically to contact terminal be bonded. rotatable orient itself respect fine wire. move under computer control make series bonds, typically between frame fingers terminals on semiconductor device.
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