Device for mounting chip-type electronic components on a substrate
作者： Godwin J. O. G. van Hooreweder
DOI:
关键词:
摘要: A device for mounting leadless chip-type electronic components on a substrate. head includes slide which is displaceable in guide single direction between loading position and an unloading position, suction vertical only at the area of position. component to be mounted, dispensed from magazine or carrier strip, transported by where picked up then moved down onto substrate device. As result controlled displacement two directions, accurate reproduceable positioning achieved.
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