Filling material, multilayer wiring board, and process of producing multilayer wiring board
作者： Makoto Wakazono , Toshikatu Takada , Toshifumi Kojima
DOI:
关键词:
摘要: A solvent-free filling material comprising a filler, thermosetting resin, curing agent, and catalyst, wherein the resin is an epoxy agent dicyandiamide agent; multilayer printed wiring board substrate, through-hole, conductor layer formed on exposed surface of in through-hole; process for producing board.
google.it 参考文章(29)
Kouji Kawakita, Tatsuo Ogawa, Seiichi Nakatani, Conductive paste composition for via hole filling and printed circuit board using the same ,(1998)
Thomas R. Miller, Douglas O. Powell, Manh-Quan T. Nguyen, Robert M. Japp, Brian E. Curcio, Frank D. Egitto, Method and structure for small pitch z-axis electrical interconnections ,(2002)
Kyoichi Yoda, Norio Kimura, Yasukazu Watanabe, Rieko Takahashi, Liquid thermosetting resin composition, printed wiring boards and process for their production ,(2001)
Donald S. Farquhar, Voya R. Markovich, Konstantinos I. Papathomas, Brian E. Curcio, Solid via layer to layer interconnect ,(2001)
Motoo Asai, Yoichiro Kawamura, Masato Kawade, Hideki Murase, Yoshifumi Ishitani, Hideki Yano, Yasuji Hiramatsu, Ayumi Suzuki, Toshihiko Yasue, Multilayer printed circuit board, method of producing multilayer printed circuit board and resin filler ,(1999)
David R. Haas, Mavyn McAuliffe, Chengzeng Xu, Microfiber dielectrics which facilitate laser via drilling ,(2000)
Takamichi Maeda, Mituwo Oda, Masao Hayakawa, Method of making a through-hole connector ,(1980)
Hiroyuki Handa, Seiichi Nakatani, Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same ,(2001)
Tadashi Kitamura, Anisotropic conductive paste ,(2000)
Yuji Echigo, Hiroshi Takezaki, Nobuyuki Tomioka, Shirou Honda, Junko Kawasaki, Yuko Shimizu, Hiroshi Taiko, Maki Nagano, Prepreg and fiber-reinforced composite material ,(2012)