Comparative study of copper surface treatment with self-assembled monolayers of aliphatic thiol, dithiol and dithiocarboxylic acid

摘要: Abstract The stability of alkanethiol self-assembled monolayers (SAMs) on metallic substrates, in particular copper, is an important aspect for their application. Some technologies, such as lithographic patterning, can potentially benefit from the use a transient easily removal protective coatings. Other applications like corrosion resistance, and thin-film lubrication request rather robust stable films. aim this work consists comparative investigation three organothiols ( n -tetradecanethiol or RSH, 2-dodecylpropane-1,3-dithiol R(SH) 2 -tetradecanedithiocarboxylic RS H) ability to form SAMs electrochemically reduced polycrystalline copper substrates respective stability. Characterizations are carried out using contact angle goniometry, XPS, PM-IRRAS electrochemical studies (CV, LSV cathodic desorption). leads with lower molecular organization than case RSH H molecules. found more when subjected both anodic desorption tests.