RF and MMIC stackable micro-modules
作者： Ganesh Vetrivel Periasamy , Mihai Dragos Rotaru , Ranganathan Nagarajan , Seung Uk Yoon , Vaidyanathan Kripesh
DOI:
关键词:
摘要: A new method to form shielded vias with microstrip ground plane in the manufacture of an integrated circuit device is achieved. The comprises, first, providing a substrate. substrate etched through holes for planned plane. first dielectric layer formed overlying top side and lining holes. conductive deposited second filling planarized confine thereby complete Silicon carrier modules stacked, multiple are using improve RF performance.
google.de 参考文章(10)
David M. White, Method for manufacturing a coaxial interconnect ,(1995)
Leonard Forbes, Kie Y. Ahn, High performance silicon contact for flip chip ,(2002)
Goran S. Matijasevic, Pradeep Gandhi, Catherine A. Gallagher, M. Albert Capote, Vertically interconnected electronic assemblies and compositions useful therefor ,(1998)
Steven Howard Voldman, James Marc Leas, Method for forming a monolithic electronic module by dicing wafer stacks ,(1996)
Sang Hoo Dhong, Harm Peter Hofstee, Michael Jay Shapiro, Silicon packaging with through wafer interconnects ,(1999)
David John Russell, Thomas Patrick Duffy, Harold Kohn, Voya Rista Markovich, Modular circuit package having vertically aligned power and signal cores ,(1996)
Leonard Forbes, Kie Y. Ahn, System-on-a-chip with multi-layered metallized through-hole interconnection ,(2002)
Benjamin V. Fasano, Kevin M. Prettyman, Vias and method for making the same in organic board and chip carriers ,(1997)
Takahiro Imai, Method of fabricating stacked semiconductor chips ,(2003)
Stephen Joseph Gaul, System for interconnecting stacked integrated circuits ,(1995)