HERMETICALLY SEALED OPTICALLY TRANSPARENT WAFER-LEVEL PACKAGES AND METHODS FOR MAKING THE SAME
作者： Kim Jin Su , Bellman Robert Alan
DOI:
关键词:
摘要: Wafer level encapsulated packages includes a wafer, glass substrate hermetically sealed to the and an electronic component. The cladding layer fused core cavity formed in substrate. component is within cavity. In various embodiments, floor of planar substantially parallel plane defined by top surface layer. has higher etch rate etchant than wafer package optically transparent. Methods for forming devices from are also described.
lens.org 参考文章(8)
Glen Bennett Cook, Victoria Ann Edwards, Mark Owen Weller, Heather Debra Boek, Machining of fusion-drawn glass laminate structures containing a photomachinable layer ,(2014)
Mohammad Eslamy, Localized hermetic sealing of a power monitor on a planar light circuit ,(2003)
Luc Ouellet, Jules J Poisson, Wafer level packaging technique for microdevices ,(2003)
Jonas Korlach, Hovig Bayandorian, Paul Lundquist, Cheng Frank Zhong, Mathieu Foquet, Substrates and optical systems and methods of use thereof ,(2009)
Ravi Nalla, Houssam Jomaa, Omar J. Bchir, Islam Salama, Charan Gurumurthy, Yonggang Li, Substrates for optical die structures ,(2008)
Dipak Sengupta, Integrated optical sensor module ,(2012)
Hsien-Wen Hsu, Diann-Fang Lin, Jui-Hsien Chang, Wen-Kun Yang, Cmos image sensor chip scale package with die receiving through-hole and method of the same ,(2007)