An uncooled infrared focal plane array for low-cost applications fabricated with standard CMOS technology

摘要: Abstract This paper reports the design, fabrication and assessment of a low-cost uncooled infrared imager that has been conceived as general purpose system to be used in wide range applications. The fabricated using AMS 0.8 μm CYE CMOS process together with compatible front-side bulk micromachining post-process provided by CMP service TIMA laboratory. adopted approach does not involve any lithography step, material deposition or particular etch-stop technique after process, so cost is almost equal chip cost. composed focal plane array (FPA) 16 × 16 thermopile pixels, which are monolithically integrated addressing readout electronics. Each pixel consists thermally isolated micromachined membrane suspended two arms contain polysilicon/aluminium thermocouples embedded sensor. also includes heating resistor intended implement self-test function allows an electrical test FPA without need specific equipment. Since voltage levels generated pixels few μV channel low-noise amplifier high variable gain can tuned for different operation conditions. circuit makes use chopper principle correlated double sampling reduce noise floor offset levels. Optical measurements performed prototypes have shown responsivity 15.0 V/W, equivalent power 1.37 nW normalized detectivity 1.05 × 107 cm Hz1/2 W−1, values line current state art. features maximum 85 dB 4.3 kHz bandwidth input 22 nV/Hz1/2. An based on build thermal imaging demonstrated.